Decapitated Ryzen 7 5800X3D shows interesting details – Hardwareluxx

Decapitating a processor, meaning removing the heat spreader and changing the material between the actual chip and the heat spreader, is an almost everyday procedure for extreme overclockers and enthusiasts. However, with the soldering that has now been carried out by the manufacturer in the high-end models from Intel and AMD, the advantages of this measure have shrunk further and further. There is also the risk of damage if an attempt is made to loosen the adhesive with a razor blade.

But even if the temperature plus is only slight, users keep trying to squeeze the last bit of performance out of the processor. So do twitterers @Madness!, who beheaded a Ryzen 7 5800X3D (we tested it). It is likely to be the first processor that has been decapitated and for which there is at least a little documentation.

AMD Ryzen 7 5800X3D Delidded
AMD Ryzen 7 5800X3D Delidded

AMD Ryzen 7 5800X3D Delidded

At first we didn’t have any comparative values, but now we have them submitted by the user. A Noctua NH-D14 with a fan was used and under these conditions the processor regularly reached a temperature of 90 °C. The screenshot shown shows a maximum temperature of 80 °C before, after which it should be 70 °C. The average falls from 78 to 67 °C. The average and maximum clock rates increase only slightly. The temperatures are therefore significantly lower, but this does not seem to have a major impact on the performance.

AMD Ryzen 7 5800X3D Delidded

But what’s under the hood is no less interesting. A third pad can also be seen on the carrier PCB, on which the CCD and the IOD are attached, on which the second CCD would sit. However, the Ryzen 7 5800X3D does not have this second CCD. There is also no second CCD on the Ryzen 7 5800X and the Ryzen models with eight or fewer cores and the carrier PCB also does not show a contact pad. The Ryzen 7 5800X3D, on the other hand, has this. Just like the SMD components around the processor, the pad has been provided with a protective coating (glob top).

It seems as if AMD intended or used the carrier PCB of a dual CCD processor here, but then didn’t do it that way and equipped the processor with only one CCD. Why AMD is doing this and whether it was intended to launch a Ryzen 9 5900X3D/5950X3D is not known.

We would not have expected the way AMD proceeded here from a retail product. A sample with the C4 pad present, plus the pre-solder and glob top would have been less surprising.


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